SuperOp! 2007 – The Interoperability Testing Event

February 27, 2007

IMTC is holding its major test event – SuperOp!, in Jesie Italy in April 2007. The event, bringing together experts from across the globe, helps our member companies to roll out better products, after they were tested in real life environment, with competing companies. As a collaborative effort, it has a proven advantage to our members, in product readiness and shortened time to market. On top of rigorous testing effort, engineers from all around the world have the opportunity to network, discuss industry issues, and have some fun – organized trips, parties, and drinks are all part of the package.

The event is a must event for all companies and organizations delivering multimedia telecommunications products and services today, and provides unprecedented opportunities to interact and test new or next generation products and services.

IMTC and Aethra will be host to engineers from across the globe at the Federico II Hotel in Jesi, Italy from April 23 to April 27. IMTC AG leaders along with Aethra, Polycom, RADVISION, Tandberg, LifeSize and Ximpo have planned and will coordinate the event, along with the kind support of Regione Marche. Infrastructure equipment used for the event will be provided by Aethra, Polycom and Telecom Italia.

During the event, a live video link-up will take place with Andrew Davis, Senior Analyst and Managing Partner at Wainhouse Research, the independent market research firm that focuses on critical issues in the Unified Communications and rich media conferencing fields. The video link will take place during the Wainhouse Research Collaboration Summit in Berlin, an event focusing on new solutions for unified collaborative communications.

SuperOp! 2007 is open for registration until March 21.

See you all in Jesie!

 

One Response to “SuperOp! 2007 – The Interoperability Testing Event”


  1. [...] in April, IMTC members will get together for annual SuperOp! 2007 event ( April 23-27, in Jesi, Italy), to test all the latest developments in SIP, IMS, 3G-324M, [...]


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